Designinitiative Mikroelektronik (BMFTR)
The federal design initiative bundles Germany's chip-design funding: DE:Sign and DE:Sign Challenge calls, the Chipdesign Germany network, the IHP open-source platform, the German Chip Competence Centre (APECS interface), Skills4Chips/Microtec Academy, and the Kompetenzzentrum Chipdesign call (April 2026). Cumulative investment ~€97M as of mid-2026, focused on open-source EDA, design capability, and training.
Key parameters
| Cumulative investment | €97M As of mid-2026 |
|---|---|
| Components | DE:Sign, DE:Sign Challenge, Chipdesign Germany, IHP open-source platform, German Chip Competence Centre (APECS), Skills4Chips/Microtec Academy, Kompetenzzentrum Chipdesign |
| Focus | Open-source EDA, chip-design capabilities, training |
| Access route | Consortium or project application per call |
Eligibility
- HQ
- Any headquarters country
- Local presence
- Separate legal entity required The applicant must be a separate legal person (e.g. GmbH, BV, SARL) — a branch office of a foreign company does not qualify here.
- R&D substance
- Required
- Company size
- No size restriction
- Models
- Fabless design, IP licensing, IDM, EDA / tools
- Sectors
- All
- Goals
- Additional design site in Europe; R&D cooperation without own site; Access to pilot lines & prototyping
Call-based under §§23/44 BHO. A German R&D partner is typically needed; foreign-headquartered groups participate through a German entity or in consortium with German research institutes.
Mechanism & application
Discretionary (call-based) — Competitive, call-based — requires approval; success not guaranteed.
Respond to individual funding calls (Förderrichtlinien) via the easy-Online portal; typically two-stage (sketch, then full proposal), often as a consortium with research partners.
Timeline: Call-dependent; typically 6–12 months from sketch to grant
Legal basis & sources
- Legal basis
- Individual Förderrichtlinien under §§23/44 BHO
- Verification
- elektronikforschung.de/fokusthemen/designinitiative
Changelog
-
1 Apr 2026
Kompetenzzentrum Chipdesign call published.
Source: BMFTR / elektronikforschung.de